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ISSN: 2661-3212 (Online)

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Semiconductor Science and Information Devices is an international peer-reviewed journal operating under the open-access model. As a critical component of electronics and information devices, semiconductors have become an important research area in the field. The journal aims to present innovative insights in the field of semiconductor science and information device research.

The scope of the Semiconductor Science and Information Devices includes:

  • Semiconductor science: Very large scale integration (VLSI) for signal processing, System on Chip (SoC), Display technologies, Heat sinks, Application specific integrated circuits (ASIC), Photolithography, Etching, Parallel processing, Electromigration, Sensors, Nanotechnology.
  • Information devices: Telecommunications systems, Signal processing, Microwave engineering, Quantum communications, Ccryptography, Information theory, Optical communications (LiFi), Power engineering, Renewable energy sources, Physical (PHY) layer, Medium access control (MAC) layer , Application (APP) layer, Software engineering, 5G and beyond, Telemedicine.

Submission Preparation Checklist

By submitting a manuscript to the journal, the Author(s) verifies that the following items have been met:
  1. The submission has not been previously published under another journal, or is currently under consideration for another journal.
  2. The submission format should be in Microsoft Word. Other word processing software may be considered.
  3. DOIs or URLs have been provided wherever possible in the Reference List.
  4. The document(s) have been formatted according to the requirements under Author Guidelines. The placement of illustrations, figures, graphs, tables, and equations have been integrated into the main manuscript.
  5. Instructions in Ensuring a Blind Review have been followed in order to comply with the double-blind peer review process employed.

Vol 4, No 2 (2022): In Progress

Table of Contents

Articles

Convection Heat Transfer from Heated Thin Cylinders Inside a Ventilated Enclosure
Ali Riaz, Adnan Ibrahim, Muhammad Sohail Bashir, Muhammad Abdullah, Ajmal Shah, Abdul Quddus

Article ID: 4719
Views - 134  (Abstract) PDF - 12  (Download)
Abstract: Experimental study was conducted to determine the effect of velocity of axial fan, outlet vent height, position, area, and aspect ratio (h/w) of ventilated enclosure on convection heat transfer. Rectangular wooden ventilated enclosure having top and front transparent wall was made up of Perspex for visualization, and internal physical dimensions of box we...
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10-16
Experimentation on Optimal Configuration and Size of Thin Cylinders in Natural Convection
Ali Riaz, Adnan Ibrahim, Muhammad Sohail Bashir, Masroor Asghar, Muhammad Abdullah, Ajmal Shah

Article ID: 4720
Views - 40  (Abstract) PDF - 2  (Download)
Abstract: In this paper, an experimental study of laminar, steady state natural convection heat transfer from heated thin cylinders in an infinite air medium has been reported. Two electrically heated cylinders having the same slenderness ratio (L/D) i.e. 6.1 but different diameters i.e. 3.8 cm and 5.08 cm were used. 105 experiments were carried out to study the ef...
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17-28
Electronic Structure of CdS Nanoparticles and CdSe/CdS Nanosystems
V. Zavodinsky, O. Gorkusha, A. Kuz'menko

Article ID: 4708
Views - 0  (Abstract) PDF - 0  (Download)
Abstract: The electronic states of “wurtzite” CdS nanoparticles and CdSe/CdS nanosystems with up to 80 pairs of Cd-Se or CdS atoms were calculated.The results for CdS particles were compared with the results obtained earlier for CdSe particles of the same size and with published calculations of other authors. The calculated gap values in the range of 2.84 eV ~ 3.78...
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29-34

Review

Signal and Power Integrity Challenges for High Density System-on-Package
Nathan Totorica, Feng Li

Article ID: 4475
Views - 87  (Abstract) PDF - 17  (Download)
Abstract:As the increasing desire for more compact, portable devices outpaces Moore’s law, innovation in packaging and system design has played a significant role in the continued miniaturization of electronic systems.Integrating more active and passive components into the package itself, as the case for system-on-package (SoP), has shown very promising results in ov...
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1-9

Announcements

 

Join as Editorial Board Member:Semiconductor Science and Information Devices

  

Semiconductor Science and Information Devices is recruiting new Editorial Board Members (EBMs) to join the Editorial Board. We are expanding our Editorial Board to ensure the journal is able to cope with an increasing number of submissions whilst maintaining high editorial standards.

Semiconductor Science and Information Devices is an open access, peer-reviewed journal .We welcome applications from researchers working across all Semiconductor Science.

  
Posted: April 28,2022
 
More Announcements...