ISSN: 2661-3212 (Online) Email:ssid@bilpublishing.com | Semiconductor Science and Information Devices is an international peer-reviewed journal operating under the open-access model. As a critical component of electronics and information devices, semiconductors have become an important research area in the field. The journal aims to present innovative insights in the field of semiconductor science and information device research. The scope of the Semiconductor Science and Information Devices includes:
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Submission Preparation Checklist
- The submission has not been previously published under another journal, or is currently under consideration for another journal.
- The submission format should be in Microsoft Word. Other word processing software may be considered.
- DOIs or URLs have been provided wherever possible in the Reference List.
- The document(s) have been formatted according to the requirements under Author Guidelines. The placement of illustrations, figures, graphs, tables, and equations have been integrated into the main manuscript.
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Vol 4, No 1 (2022)
Table of Contents
Editorial
Jianhong Zhang, Chenghe Dong Article ID: 4659 Views - 0 (Abstract) PDF - 0 (Download) |
21-22
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Articles
Victor Zavodinsky, Olga Gorkusha, Alexander Kuzmenko Article ID: 4420 Views - 60 (Abstract) PDF - 22 (Download) Abstract: The authors fulfilled calculations of the total energy and electronic states of CdnSen nanoparticle:“wurzite”, “sphalerite” and “rock-salt” types of the structure. It was shown that at n ≤ 72 the “rock-salt” type is the most favorable energetically. However the extrapolation of the behavior of the energy per Cd-Se atomic pair shows that fo...
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1-7
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Mario Di Cino, Feng Li Article ID: 4474 Views - 54 (Abstract) PDF - 10 (Download) Abstract: Flip chip die-to-wafer bonding faces challenges for industry adoption due to a variety of technical gaps or process integration factors that are not fully developed to high volume manufacturing (HVM) maturity. In this paper,flip-chip and wire bonding are compared, then flip-chip bonding techniques are compared to examine advantages for scaling ...
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8-13
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Announcements
Join as Editorial Board Member:Semiconductor Science and Information Devices |
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Semiconductor Science and Information Devices is recruiting new Editorial Board Members (EBMs) to join the Editorial Board. We are expanding our Editorial Board to ensure the journal is able to cope with an increasing number of submissions whilst maintaining high editorial standards. Semiconductor Science and Information Devices is an open access, peer-reviewed journal .We welcome applications from researchers working across all Semiconductor Science. |
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Posted: April 28,2022 | |
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