Signal and Power Integrity Challenges for High Density System-on-Package

Authors

  • Nathan Totorica Department of Electrical and Computer Engineering, University of Idaho, Moscow, Idaho, 83844, USA
  • Feng Li Department of Electrical and Computer Engineering, University of Idaho, Moscow, Idaho, 83844, USA

DOI:

https://doi.org/10.30564/ssid.v4i2.4475

Abstract

As the increasing desire for more compact, portable devices outpaces Moore’s law, innovation in packaging and system design has played a significant role in the continued miniaturization of electronic systems.Integrating more active and passive components into the package itself, as the case for system-on-package (SoP), has shown very promising results in overall size reduction and increased performance of electronic systems.With this ability to shrink electrical systems comes the many challenges of sustaining, let alone improving, reliability and performance. The fundamental signal, power, and thermal integrity issues are discussed in detail, along with published techniques from around the industry to mitigate these issues in SoP applications.

Keywords:

System on package (SoP), System in package (SiP), System on chip (SoC), Through silicon via (TSV), Signal integrity, Power integrity, Thermal integrity

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How to Cite

Totorica, N., & Li, F. (2022). Signal and Power Integrity Challenges for High Density System-on-Package. Semiconductor Science and Information Devices, 4(2), 1–9. https://doi.org/10.30564/ssid.v4i2.4475

Issue

Vol. 4 , Iss. 2 (October 2022)

Article Type

Review

License

Copyright © 2022 Nathan Totorica, Feng Li

Creative Commons License

This is an open access article under the Creative Commons Attribution-NonCommercial 4.0 International (CC BY-NC 4.0) License.

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