ISSN: 2661-3212 (Online)

Aims and Scope

Semiconductor Science and Information Devices is an international peer-reviewed journal operating under the open-access model. As a critical component of electronics and information devices, semiconductors have become an important research area in the field. The journal aims to present innovative insights in the field of semiconductor science and information device research.

The scope of the Semiconductor Science and Information Devices includes:

  • Semiconductor science: Very large scale integration (VLSI) for signal processing, System on Chip (SoC), Display technologies, Heat sinks, Application specific integrated circuits (ASIC), Photolithography, Etching, Parallel processing, Electromigration, Sensors, Nanotechnology.
  • Information devices: Telecommunications systems, Signal processing, Microwave engineering, Quantum communications, Ccryptography, Information theory, Optical communications (LiFi), Power engineering, Renewable energy sources, Physical (PHY) layer, Medium access control (MAC) layer , Application (APP) layer, Software engineering, 5G and beyond, Telemedicine.

Submission Preparation Checklist

By submitting a manuscript to the journal, the Author(s) verifies that the following items have been met:
  1. The submission has not been previously published under another journal, or is currently under consideration for another journal.
  2. The submission format should be in Microsoft Word. Other word processing software may be considered.
  3. DOIs or URLs have been provided wherever possible in the Reference List.
  4. The document(s) have been formatted according to the requirements under Author Guidelines. The placement of illustrations, figures, graphs, tables, and equations have been integrated into the main manuscript.
  5. Instructions in Ensuring a Blind Review have been followed in order to comply with the double-blind peer review process employed.

Volume 4, Issue 2 (2022)

Table of Contents


Ali Riaz, Adnan Ibrahim, Muhammad Sohail Bashir, Muhammad Abdullah, Ajmal Shah, Abdul Quddus

Article ID: 4719
Views - 235  (Abstract) PDF - 31  (Download)
Abstract: Experimental study was conducted to determine the effect of velocity of axial fan, outlet vent height, position, area, and aspect ratio (h/w) of ventilated enclosure on convection heat transfer. Rectangular wooden ventilated enclosure having top and front transparent wall was made up of Perspex for visualization, and internal physical dimensions of box we...
Ali Riaz, Adnan Ibrahim, Muhammad Sohail Bashir, Masroor Asghar, Muhammad Abdullah, Ajmal Shah

Article ID: 4720
Views - 103  (Abstract) PDF - 21  (Download)
Abstract: In this paper, an experimental study of laminar, steady state natural convection heat transfer from heated thin cylinders in an infinite air medium has been reported. Two electrically heated cylinders having the same slenderness ratio (L/D) i.e. 6.1 but different diameters i.e. 3.8 cm and 5.08 cm were used. 105 experiments were carried out to study the ef...
V. Zavodinsky, O. Gorkusha, A. Kuz'menko

Article ID: 4708
Views - 82  (Abstract) PDF - 20  (Download)
Abstract: The electronic states of “wurtzite” CdS nanoparticles and CdSe/CdS nanosystems with up to 80 pairs of Cd-Se or CdS atoms were calculated.The results for CdS particles were compared with the results obtained earlier for CdSe particles of the same size and with published calculations of other authors. The calculated gap values in the range of 2.84 eV ~ 3.78...
Rajesh Shrestha, Manik Maharjan, Mahesh Sharma

Article ID: 4884
Views - 120  (Abstract) PDF - 17  (Download)
Abstract: Air is one of the essential elements of human’s surroundings. The earth’s atmosphere is full of air which contains gases such as Nitrogen, Oxygen, Carbon Monoxide and traces of some rare elements. But quality of the air has been degrading for some decades due to various activities conducted by the human beings that directly or indirectly affect the atmosp...


Nathan Totorica, Feng Li

Article ID: 4475
Views - 189  (Abstract) PDF - 36  (Download)
Abstract:As the increasing desire for more compact, portable devices outpaces Moore’s law, innovation in packaging and system design has played a significant role in the continued miniaturization of electronic systems.Integrating more active and passive components into the package itself, as the case for system-on-package (SoP), has shown very promising results in ov...



SSID Volume 4, Issue 2 is now live!


We are pleased to announce that Volume 4, Issue 2 (2022) of Semiconductor Science and Information Devices has been published, and is currently available for download.

The process of collating and peer review for the next issue release has already begun.

If you have any manuscripts on hand that you are looking to have published with us, we would be glad to include it in the next issue. Moreover, if you know of any colleagues, or students under your direction who are looking to publish manuscripts, we would be glad to receive their manuscripts under your recommendation as well.

Posted: December 14,2022
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