Semiconductor Science and Information Devices

Adedibu, O. A., Department of System Engineering, University of Lagos, Akoka, Lagos State, Nigeria
Adeleye, O. A., Department of Electrical Engineering, The Polytechnic, Ibadan, Oyo State, Nigeria
Adesina, A. O., Department of Mechanical Engineering, University of Lagos, Akoka, Lagos State, Nigeria
Adesina, O. A., Department of Mechanical Engineering, University of Lagos, Akoka, Lagos, Nigeria
Almamori, Aqiel, Electronic and Communication Engineering Department, College of Engineering, University of Baghdad, Baghdad,47202, Iraq
Alwahib, Ali A., Department of Laser and Optoelectronics Engineering, University of Technology, Baghdad, 47202, Iraq
Ardo, Abdulhamid, Department of Information Technology, Faculty of Computing, Federal University Dutse Jigawa State, Nigeria (Nigeria)
Awasthi, Anshuman, Engineering, Restoration Hardware (United States)
Bauchspiess, Adolfo, University of Brasília (UnB), Campus Darcy Ribeiro, Asa Norte, Brasília-DF, Brazil. (Brazil)
Berestova, Tatiana, Chelyabinsk State Institute of Culture, Chelyabinsk, 454 000, Russia (Russian Federation)
Bogati, Sabina, Tri-Chandra Multiple College, TU, Ghantaghar, Nepal (Nepal)
Coelho, Marco Antonio Freitas do Egito, University of Brasília (UnB), Campus Darcy Ribeiro, Asa Norte, Brasília-DF, Brazil. (Brazil)
Curran, Kevin, School of Computing, Engineering & Intelligent Systems, Ulster University, UK (United Kingdom)
Curran, Kevin, Ulster University, Derry, United Kingdom (United Kingdom)
Dhungana, Bibek, Tri-Chandra Multiple College, TU, Ghantaghar, Nepal (Nepal)
Di Cino, Mario, Department of Electrical and Computer Engineering, University of Idaho, Moscow, Idaho, 83844, USA (United States)
Divan, Ralu, Center for Nanoscale Materials, Argonne National Laboratory, 9700 S-Cass Avenue, Lemont, IL-60439, USA (United States)
Dong, Chenghe, School of Information, North China University of Technology, Beijing, China
Farrelly, William, Letterkenny Institute of Technology, Letterkenny, Ireland (Ireland)
Gao, Shuo, Beihang University (China)
Garcia, Carlos, National High Magnetic Field Laboratory, Tallahassee, FL 32310, USA (United States)
Ghosh, Saikat, Kunming University of Science and Technology, Kunming 650500, China
Giri, Pratit Raj, Department of Computer Science and Engineering, Kathmandu University, Dhulikhel, Kavre, Nepal (Nepal)
Goni, Ibrahim, Department of Computer Science, Faculty Science, Adamawa State University Mubi, Adamawa, Nigeria (Nigeria)
Goni, Ibrahim, Department of Computer Science, Adamawa State University, Mubi, Nigeria
Gorkusha, Olga, Institute of Applied Mathematics, Khabarovsk Division, Khabarovsk, 680000, Russia
Gumpy, Jerome M., Department of Computer Science, Federal University, Gashua, Nigeria
Heidari, Alireza, Faculty of Chemistry, California South University, 14731 Comet St. Irvine, CA 92604, USA ;American International Standards Institute, Irvine, CA 3800, USA (United States)
Hu, Xiaoyan, Information Science Academy of China Electronics Technology Group Corporation (China)
Hu, Zhipeng, No.38 Research Institute of China Electronics Technology Group Corporation (China)
Ibrahim, S. A., Department of Mechanical Engineering, University of Lagos, Akoka, Lagos, Nigeria
II, Frederick Jackson, Layered Materials and Device Physics Laboratory, Department of Chemistry, Physics and Atmospheric Science, Jackson State University, Jackson, MS 39217, USA (United States)
Jin, Li, No.38 Research Institute of China Electronics Technology Group Corporation (China)
John, Ayuba, Department of Cyber Security, Faculty of Computing, Federal University Dutse Jigawa State, Nigeria (Nigeria)
Kumar, Ashish, Department of Electrical Engineering, National Cheng Kung University, Taiwan (Taiwan)
Kuzmenko, Alexander, South-West State University, Kursk, 305040, Russia
Kyu Win, Khin Kyu, Department of Electronic Engineering, Yangon Technological University, Insein Township, Republic of the Union of Myanmar
Lee, Wen-Hsi, Department of Electrical Engineering, National Cheng Kung University, Taiwan (Taiwan)
Li, Feng, Department of Electrical and Computer Engineering, University of Idaho, Moscow, Idaho, 83844, USA
Li, Feng, Department of Electrical and Computer Engineering University of Idaho
Liang, Xinyu, State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China (China)
Maigari, Timothy U., Department of Computer Science, Federal College of Education Gombe, Nigeria
Mc Brearty, Shaun, Institute of Technology, Sligo, Ireland (Ireland)
McGill, Stephen A., National High Magnetic Field Laboratory, Tallahassee, FL 32310, USA (United States)
Mohammad, Murtala, Department of Computer Science, Faculty Science, Adamawa State University Mubi, Adamawa, Nigeria
Mohammad, Murtala, Department of Computer Science, Adamawa State University, Mubi, Nigeria
Mohammed, Husam Abduldaem, Electronic and Communication Engineering Department, College of Engineering, University of Baghdad, Baghdad,47202, Iraq (Iraq)
Naing, Zaw Min, Department of Research and Innovation, Ministry of Education, Bahan Township, Republic of the Union of Myanmar
Nash, Jawnaye, Layered Materials and Device Physics Laboratory, Department of Chemistry, Physics and Atmospheric Science, Jackson State University, Jackson, MS 39217, USA (United States)
Oroski, Elder, Federal University of Technology of Paraná (UTFPR), Avenida Sete de Setembro 3165, 80230-901, Curitiba-PR, Brazil. (Brazil)
Oyekeye, O. M., Department of Mechanical Engineering, University of Lagos, Akoka, Lagos, Nigeria
Pathak, Gyanesh Kumar, Indian Institute of Technology Kanpur, India (India)
Pês, Beatriz, Federal Institute of Paraná (IFPR), Rua Engenheiro Tourinho, 829, Campo Largo-PR, Brazil (Brazil)
Pradhan, Devasis, Department of Electronics & Communication Engineering, Acharya Institute of Technology, Bengaluru, India
Pradhan, Nihar R., Layered Materials and Device Physics Laboratory, Department of Chemistry, Physics and Atmospheric Science, Jackson State University, Jackson, MS 39217, USA; National High Magnetic Field Laboratory, Tallahassee, FL 32310, USA (United States)
Rafferty, Dylan, School of Computing, Engineering & Intelligent Systems, Ulster University, UK (United Kingdom)
Ray, Paresh C., Layered Materials and Device Physics Laboratory, Department of Chemistry, Physics and Atmospheric Science, Jackson State University, Jackson, MS 39217, USA (United States)
Reddy, A. Phani Kumar, Indian Institute of Technology Kanpur, India (India)
Rosenmann, Daniel, Center for Nanoscale Materials, Argonne National Laboratory, 9700 S-Cass Avenue, Lemont, IL-60439, USA (United States)
Sahu, Prasanna Kumar, Department of Electrical Engineering, National Institute of Technology, Rourkela, Odisha, India
Saidu, Abdulrahman, Department of Computer Science, Faculty of Science, Federal Polytechnic Bali, Taraba, Nigeria (Nigeria)
Salami, M. O., Department of Mechanical Engineering, University of Lagos, Akoka, Lagos, Nigeria
Sharma, Gajendra, Department of Computer Science and Engineering, Kathmandu University, Dhulikhel, Kavre, Nepal (Nepal)
Sharma, Mahesh, Tri-Chandra Multiple College, TU, Ghantaghar, Nepal
Shawon, Md Jubayer Shawon, Department of Electrical and Computer Engineering University of Idaho
Shi, Yuhao, State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China (China)
Shrestha, Rajesh, Tri-Chandra Multiple College, TU, Ghantaghar, Nepal
Singh, Shivani, Indian Institute of Technology Kanpur, India (India)
Smith, Benjamin Ashby, School of Computing, Engineering & Intelligent Systems, Ulster University, UK (United Kingdom)
Sobamowo, M. G., Department of Mechanical Engineering, University of Lagos, Akoka, Lagos, Nigeria (Nigeria)
Sobamowo, M. G., Department of Mechanical Engineering, University of Lagos, Akoka, Lagos State, Nigeria (Nigeria)
Stan, Liliana, Center for Nanoscale Materials, Argonne National Laboratory, 9700 S-Cass Avenue, Lemont, IL-60439, USA (United States)
Sumant, Anirudha V., Center for Nanoscale Materials, Argonne National Laboratory, 9700 S-Cass Avenue, Lemont, IL-60439, USA (United States)
T., Umar Maigari, Department of Computer Science, Faculty of Science, Federal College of Education Gombe, Gombe state, Nigeria (Nigeria)
Tanthirige, Rukshan M., Layered Materials and Device Physics Laboratory, Department of Chemistry, Physics and Atmospheric Science, Jackson State University, Jackson, MS 39217, USA (United States)
Tun, Hla Myo, Department of Electronic Engineering, Yangon Technological University, Insein Township, Republic of the Union of Myanmar
Udousoro, Isonkobong Christopher, Department of Information Technology, School of Computing and Information Technology, Federal University of Technology, Owerri
Vasudevan, Kasturi, Indian Institute of Technology Kanpur (India)
Vasudevan, Kasturi, Indian Institute of Technology Kanpur, India (India)
Vasudevan, Kasturi, IIT, Kanpur, India (India)
Wang, Chunqing, State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China (China)
Wang, Linsheng, Shokubai Wang Institute, Tokyo, Japan; National Institute for Materials Science, Tsukuba, Japan; The University of Electro-Communications, Tokyo, Japan
Wang, Weiping, Information Science Academy of China Electronics Technology Group Corporation, Beijing, China, 100086 (China)
Williamson, Joseph, School of Computing, Engineering & Intelligent Systems, Ulster University, UK (United Kingdom)
Yinusa, A A., Department of Mechanical Engineering, University of Lagos, Akoka, Lagos, Nigeria
Yusuf, Abdulazeez, Department of Cyber Security, Faculty of Computing, Federal University Dutse Jigawa State, Nigeria (Nigeria)
Zavodinsky, Victor, Institute of Applied Mathematics, Khabarovsk Division, Khabarovsk, 680000, Russia
Zhang, Jianhong, School of Information, North China University of Technology, Beijing, China
Zhao, Shaoyu, Information Science Academy of China Electronics Technology Group Corporation (China)
Zheng, Zhen, State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China (China)

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